FEATURES
- Ultra-high Power Generation/Ultra-high Efficiency
- Higher Bifacial Gain
- Enhanced Reliability
- Lower LID / LETID
- High Compatibility
- Optimized Temperature Coefficient
- Lower Operating Temperature
- Optimized Degradation
- Outstanding Low Light Performance
- Exceptional PID Resistance
Detail
- SMBB Technology: Better light trapping and current collection to improve
module power output and reliability - PID Resistance: Excellent Anti-PID performance guarantee via
optimized mass-production process and materials
control. - Higher Power Output: Module power increases 5-25% generally, bringing
significantly lower LCOE and higher IRR - Hot 2.0 Technology: The N-type module with Hot 2.0 technology has better
reliability and lower LID/LETID. - Enhanced Mechanical Load: Certified to withstand: wind load (2400 Pascal) and snow
load (5400 Pascal).
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